multilayer ceramic chip capacitors 1 of 3 creation date : june 29, 2017 (gmt) cga4j3x7r1c335m125ab tdk item description cga4j3x7r1c335mt**** applications automotive grade feature general general (up to 50v) aec-q200 aec-q200 series cga4(2012) [eia 0805] status production size length(l) 2.00mm 0.20mm width(w) 1.25mm 0.20mm thickness(t) 1.25mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 3.3f 20% rated voltage 16vdc temperature characteristic x7r(15%) dissipation factor (max.) 7.5% insulation resistance (min.) 30m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : june 29, 2017 (gmt) cga4j3x7r1c335m125ab characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cga4j3x7r1c335m125ab esr cga4j3x7r1c335m125ab capacitance cga4j3x7r1c335m125ab dc bias characteristic cga4j3x7r1c335m125ab temperature characteristic cga4j3x7r1c335m125ab(no bias) cga4j3x7r1c335m125ab(dc bias = 8v ) ripple temperature rising cga4j3x7r1c335m125ab(100khz) cga4j3x7r1c335m125ab(500khz) cga4j3x7r1c335m125ab(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : june 29, 2017 (gmt) cga4j3x7r1c335m125ab associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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